Experience with Microelectronics packaging processes and technology.
Programmable Epoxy Dispensing systems for die attach.
Epoxy die attach process – pick and place system or process experience.
Wafer handling and dismounting of die from wafer tape.
Thermosonic gold wire ball bonding (1.3 mil wire, ball and stitch bonding)
Laser Welding used for Hermetic Sealing of microelectronic packages.
Vacuum Baking process for microelectronic packages.
Fixture design for various process needs.
Knowledge of electronic assembly cleaning, especially plasma cleaning.
Statistical data analysis of the various process impacts on sensor output.
Gage Repeatability and Reproducibility (GRR) analysis for various measurement systems.
Capability Studies, PFMEA, Control plans.
Capacity and Rate Estimates and Analysis; Production cost estimating.