Requirements:
1. Bachelor degree in Physic or Engineering with at least 5 years experience in semiconductor industry (preferably surface mount and package assembly)
2. Experience in R&D work of packaging technology or material analysis is preferable.
3. Must be able to communicate fluently in English - At least CET-6 or equivalent English level
4. Intention and capability to work in a cross-functional/global team environment
5. Common sense, social confidence and maturity
6. Good team player, good problem solving skill - must be able to work with factory management and personnel to drive first level problem resolutions.
7. Able to work under conditions of great pressure and resource constraint
8. Working knowledge of design of experiments, SPC, FMEA, Process Control, Characterization and qualification.
Responsibilities:
1. Manage and direct optimization of packaging performance of RF components through assembly process to recipe tuning
2. Working with Process Engineering on packaging quality and reliability
3. Establish assembly cost structure and work with Shanghai and sourcing to populate cost models
4. Join NPI team as key member
5. Advise GM and the team on packaging knowledge and focus;
6. Support SQE on Subcon issues related to assembly and be the first contact on assembly related technical problems.
7. Coordinate with headquarter (Greensboro - Corporate Engineering and Assembly Services ) regarding assembly packaging issues and programs.
Interested Parties, please send your ENGLISH resume to:
info@carnegie-consultancy.com