Position Description Summary:
· RF IC/system test and applications in design service group.

Essential Duties and Responsibilities (in order of importance): 
· Conduct RF IC/system test and applications to market/customers.

· Responsibility:
o Board definition and test solution development with system engineers.
o Board design and outsourcing manufacturing.
o Hand welding and testing to check and debug.
o Prepare technical document and support customer.

· Experience:
o Bachelor or master degree in E.E. with 2 to 3 years or more industrial experiences on PCB design and RF test.
o Experiences in RFIC/Mixed signal IC debug/test are preferable.
o Hands on experience on Protel or ADS tools.
o Understanding wireless communication to certain degree.

· Other requirements:
o Good communication skills in both Chinese and English writing/speaking.
o Ability to take ownership and fulfill project independently.
o Good relation skills with customers.
o Multitasking and time-management skills
o May require some travel to US

Working Environment:
· Assignment Complexity
Work assignments are not routine in nature; carry out written or oral instructions involved.

· Accountability/Discretion
Assignment given could be a portion of the whole project.

· Financial Responsibilities
Engineering assignments have direct financial impact on the business performance.

· Technical Expertise
With basic knowledge of scientific concepts supported. Enable assignments technical tasks involved within well-defined boundaries.

· Working Relationships
Gets from top project and provides technical guidance to market/customers and back to IC designers.

· Supervision
Have no management responsibilities.

· Working Conditions
Normal office environment conditioned.

· Education/License Certifications
Master/PHD degree (MS Electrical Engineering or PHD Electrical Engineering)