Requirements: - Bachelor degree or above in engineering, plus 3 years relative working experience
- Strong semiconductor device physics and processing background
- Familiar with foundries and package houses in China
- Good understanding on foundry processes, package forms & testing procedures
- Knowledge of semiconductor defect/failure analysis, ESD, reliability testing, data analysis and statistics knowledge, wafer processing knowledge
- Be able to work under stress in a fast-paced environment and travel frequently
- Excellent command of both spoken and written English and Mandarin
- The position is based on Beijing or Shanghai
Responsibilities:
- Lead the efforts to understand root causes and execute on corrective actions for products not meeting expectations in performance, quality or reliability
- Perform data and failure analysis for new process yield learning, production cost reduction and discrepant material disposition
- Define and coordinate ESD/reliability tests
- Engage and establish close business relationship with foundry, package and testing vendors
- Negotiate with suppliers on pricing, delivery date and technical support