Responsibilities:

1.Support new projects on package type selection, necessity of package tooling and bumping, and all other issues related to packaging
2.Coordinate with customer and subcontractors for package quality and delivery etc
3.Work with design team for bonding feasibility study and with subcontractors for bonding diagram and package drawing.
4.Be responsible for device qualification and reliability test
5.Manufacturing control, yield analysis and improvement

Requirements:

1.Good knowledge of IC packaging (leadframe, BGA, bumping …) is essential
2.Minimum of 2 years of working experience in packaging house or design house
3.Bachelor degree or above
4.Good written and oral communication skills in English
5.Able to manage subcontractors in different locations
6.Willing to work under pressure