Location: Beijing
RESPONSIBILITIES:
1. PCB physical layout, routing, and verification
2. SI simulations for high speed PCB
3. Define optimal layout solutions with hardware designer to improve product performance
4. Generate PCB and PCBA fabrication documents.
5. Generate BOM for PCB assembly.
REQUIREMENTS:
Experience:
1. Bachelor or above, major in Electronic Engineering, Telecommunication Engineering, Computer Science or equivalent.
2. At lease 3 years experience in high speed and HDI PCB design. Experience in RF layout is preferred.
3. Skillful in using EDA tools. Mentor Board Station is preferred.
Knowledge:
1. Good knowledge of HDI PCB fabrication technology and SMT assembly processes.
2. Good knowledge of EMC, SI.
3. Good written, spoken and listening English.
4. Knowledge of electronic components
5. Knowledge of DFx
Capabilities:
1. Good communication and team work
2. Active, Self-motivated, result oriented
3. Ability to learn
4. Ability to work under high pressure